● Simple control (with various DLL for control)
● Construction of high functioning laser machining/microscopic observation systems
● Control function (for high power laser machining applications)
● Simultaneous multipoint machining by multibeam interference
Outline
This is a phase control unit for laser processing and microscopic observations, that is constructed to enable you to shape the beam easily. It is equipped with prism-type mirrors which simplify the construction of the optical system, and electronic cooling systems that improve the operation stability and the power handling capability of optical phase modulators (LCOS-SLM). In addition, it is also fitted with DLL (dynamic link libraries) and applications in the standard to support the design of phase data for beam shaping and phase control.
Supported wavelength range
Type no.
Corresponding wavelength
Unit
C15789-04M
460 to 560
nm
C15789-02
750 to 850
nm
C15789-12
850 to 1000
nm
C15789-03
1000 to 1100
nm
* Please contact us separately for other wavelengths.
General ratings
Parameter
Value
Unit
Input voltage (with AC adapter)
100 to 230 (50 Hz / 60 Hz)
V
Power consumption
35
VA
Operating temperature *1*2
+20 to +35
°C
Storage temperature
-20 to +55
°C
*1 No condensation
*2 The characteristics may change depending on the humidity.
Specification
Parameter
Value
Unit
Interface *1
DVI (digital video interface)
—
DVI signal format
SXGA (1280 pixels × 1024 pixels)
—
DVI frame rate
60
Hz
Input signal gradation value
256 (8 bits)
levels
Effective aperture
12
mm
Throughput
95 (typ.)
%
Polarization direction
Horizontal
—
Weight
2.1
kg
*1 When this product is used, a control PC (with a DVI or HDMI external monitor output terminal) must be prepared separately.
* The TEC controller C14480 is attached to this product.
Configuration diagram
Accessories specification (TEC controller C14480)
Parameter
Value
Unit
Control method
PI control
—
Power supply voltage
100 to 240
VAC
Power consumption
15
VA
Storage ambient temperature
-20 to +55
°C
Operating ambient temperature
0 to +40
°C
Dimensions (W × H × D)
140 × 136 × 40
mm
Weight
450
g
The key device gives new values to laser machining
Phase control of laser
In the field of laser machining, phase control is attracting attention. Phase control enables 2D simultaneous multipoint irradiation, 3D simultaneous multipoint irradiation, aberration correction and so on. By using wavefront shaper, you can control the phase of laser beam with high resolution and precision, then change the beam profile easily and conveniently. Wavefront shaper is the key device which gives new values to laser machining.
Comparison with DOE (Diffractive Optical Element)
DOE (Diffractive Optical Element) is one of optical element which is known as giving similar function: beam shaping.
Though DOE requires dedicated design to shape each pattern, wavefront shaper is able to switch desired beam pattern easily.
Phase control technology to improve takt time of machining
It is well known technology to scan laser with galvano mirror to perform micro-machining, however, it is difficult to shorten takt time to scan complex structure. In addition, the energy of laser is focused on irradiated spot when you use the galvano mirror, and it damages the workpieces. Wavefront shaper enable to generate intended beam pattern with single shot irradiation. It achieve to improve takt time and avoid to concentrate energy to only one spot. Therefore wavefront shaper realizes high throughput and less damage machining.
Comparing laser scans and simultaneous irradiations
Utilization of ultra-short pulsed laser
You can perform less-thermal effect processing by irradiating ultra-short pulsed laser which has femtoseconds and/or picoseconds pulse duration. For example, it can be applied to industrial applications such as improving slidability through micro-periodic structures, micro-machining such as drilling and cutting, glass bonding, and dicing.
With wavefront shaper, you may achieve high-precision and high-takt machining.
Expected applications
· Improvement of slidability by making micro-periodic structures
· Micromachining: drilling, cutting
· Industrial applications: glass bonding, optical memory, dicing
Technical feature: Utilization of high power laser
Cooling the LCOS-SLM with peltier devices
It is important to control temperature of the LCOS-SLM by peltier device in order to ensure stable operation.
• Expected profit from controlling temperature of LCOS-SLM
· Preventing unintended phase modulation
· Improving light resistance to high power laser input *
* The heat generation by the input of high power laser damage LCOS-SLM, especially liquid crystal.
Heat dissipation design of phase control unit
Optical density reduction by homogenizer
Homogenizer produces the spacial-uniform intensity within the beam profile. Uniform beam profile enables to use higher power laser with LCOS-SLM effectively. Without homogenizer, typically, the intensity within beam pattern of the laser places gaussian distribution, and the most high intensity point restrict the capability of resistance of LCOS-SLM. On the other hand, uniform beam pattern with homogenizer can reduce the density of irradiated point and relax the concentration of energy. Therefore, it is possible to use higher power laser as the light source of LCOS-SLM, and give great advantage to do simultaneous multi spot processing.
Technical feature: Improved usability
Pseudo-transmissive optical configuration
The dedicated prism type mirror enables in-align optical path for input and output beam. There is no need to do complex optical alignment, and make it easier to install into laser machining instruments.
Control program
There is complex process to achieve phase control with LCOS-SLM, and it is one of major barrier to start to use phase control technology.
Our product includes the control software, and it gives great insight for the user to use LCOS-SLM. The sample software includes the function to generate CGH (Computer Generated Hologram) to mark 2D pattern at multiple point easily.
Program for data generation
* Operation image
Applied to machining: Simultaneous multipoint irradiation
2D simultaneous multipoint irradiation
Minute 2D codes are required to achieve traceability management for such as tiny electro-components.
By using wavefront shaper together with short pulsed laser, you can make small workpieces marked finely at once.
QR code marked on the electronic components of the smartphone (image)
Holographic interference machining
Wavefront shaper achieves to form fine pitch interferometric structure in the scale of micrometer when combined with ultra-short pulsed laser.
In addition, wavefront shaper helps to improve takt time with simultaneous multi point irradiation.
Example of micro-periodic drilling of ITO (Indium Tin Oxide) thin films deposited on glass substrates
Applied to machining: Simultaneous multipoint irradiation
3D simultaneous multipoint irradiation
Simultaneous irradiation can be applied to stereoscopic marking with different focal lengths. It is possible to generate multi-point 3D pattern without moving focusing lenses or the workpieces since the phase controlling can achieve to control focal length.
Example and conceptual diagram of multipoint laser beam generation
Optical aberration correction for internal machining
Wavefront shaper can also correct the spherical aberrations that occurs when conducting internal machining for transparent materials.